Chemical content PIMP31-Q

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Type numberPackagePackage descriptionTotal product weight
PIMP31-QSOT457SC-7410.88818 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934664163115212601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10000100.000000.91843
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.003190.080000.02932
Carbon (C)7440-44-00.001600.040000.01466
Chromium (Cr)7440-47-30.008380.210000.07696
Cobalt (Co)7440-48-40.016760.420000.15391
Iron (Fe)7439-89-61.8840847.2200017.30388
Manganese (Mn)7439-96-50.033920.850000.31148
Nickel (Ni)7440-02-01.4192435.5700013.03471
Phosphorus (P)7723-14-00.000800.020000.00733
Silicon (Si)7440-21-30.009980.250000.09161
Sulphur (S)7704-34-90.000800.020000.00733
Pure metal layerCopper (Cu)7440-50-80.5210913.060004.78587
Silver (Ag)7440-22-40.090172.260000.82818
Mould CompoundFillerSilica fused60676-86-04.4412071.0000040.78922
PigmentCarbon black1333-86-40.018770.300000.17235
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2322819.7000011.31757
Phenolic resinProprietary0.562979.000005.17046
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00014
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00024
Tin solderTin (Sn)7440-31-50.5212299.990004.78699
WirePure metalGold (Au)7440-57-50.02170100.000000.19930
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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