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Chemical content PMBT2222AQA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMBT2222AQASOT1215DFN1010D-31.15456 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660461147212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000331.000000.02858
FillerSilver (Ag)7440-22-40.0277284.000002.40091
PolymerBismaleimidodiphenylmethane resin 0.0033010.000000.28582
Isobornyl Methacrylate7534-94-30.001655.000000.14291
subTotal0.03300100.000002.85822
DieDoped siliconSilicon (Si)7440-21-30.05000100.000004.33065
subTotal0.05000100.000004.33065
Lead FrameCopper alloyCopper (Cu)7440-50-80.4787591.5400041.46638
Magnesium (Mg)7439-95-40.000890.170000.07701
Nickel (Ni)7440-02-00.014912.850001.29101
Silicon (Si)7440-21-30.003240.620000.28085
Pure metal layerGold (Au)7440-57-50.000370.070000.03171
Nickel (Ni)7440-02-00.022754.350001.97049
Palladium (Pd)7440-05-30.002090.400000.18119
subTotal0.52300100.0000045.29864
Mould CompoundFillerSilica -amorphous-7631-86-90.1177623.0000010.19956
Silica fused60676-86-00.3072060.0000026.60754
Flame retardantMetal hydroxideProprietary0.015363.000001.33038
ImpurityBismuth (Bi)7440-69-90.002560.500000.22173
PigmentCarbon black1333-86-40.002560.500000.22173
PolymerEpoxy resin systemProprietary0.035847.000003.10421
Phenolic resinProprietary0.030726.000002.66075
subTotal0.51200100.0000044.34590
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00139
Tin solderTin (Sn)7440-31-50.0289899.940002.51027
subTotal0.02900100.000002.51177
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0075699.990000.65508
subTotal0.00756100.000000.65515
total1.15456100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.