Chemical content PMBT2222AQA

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Type numberPackagePackage descriptionTotal product weight
PMBT2222AQASOT1215DFN1010D-31.15456 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346604611472126030 s123520 s3D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000331.000000.02858
FillerSilver (Ag)7440-22-40.0277284.000002.40091
PolymerBismaleimidodiphenylmethane resin 0.0033010.000000.28582
Isobornyl Methacrylate7534-94-30.001655.000000.14291
DieDoped siliconSilicon (Si)7440-21-30.05000100.000004.33065
Lead FrameCopper alloyCopper (Cu)7440-50-80.4787591.5400041.46638
Magnesium (Mg)7439-95-40.000890.170000.07701
Nickel (Ni)7440-02-00.014912.850001.29101
Silicon (Si)7440-21-30.003240.620000.28085
Pure metal layerGold (Au)7440-57-50.000370.070000.03171
Nickel (Ni)7440-02-00.022754.350001.97049
Palladium (Pd)7440-05-30.002090.400000.18119
Mould CompoundFillerSilica -amorphous-7631-86-90.1177623.0000010.19956
Silica fused60676-86-00.3072060.0000026.60754
Flame retardantMetal hydroxideProprietary0.015363.000001.33038
ImpurityBismuth (Bi)7440-69-90.002560.500000.22173
PigmentCarbon black1333-86-40.002560.500000.22173
PolymerEpoxy resin systemProprietary0.035847.000003.10421
Phenolic resinProprietary0.030726.000002.66075
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00139
Tin solderTin (Sn)7440-31-50.0289899.940002.51027
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0075699.990000.65508
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.