×

Chemical content PMBT2907AM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMBT2907AMSOT883XQFN30.87622 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660375315312601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.86736
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.11949
Phenolic resinProprietary0.0013513.530000.15441
subTotal0.01000100.000001.14126
DieDoped siliconSilicon (Si)7440-21-30.05000100.000005.70633
subTotal0.05000100.000005.70633
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100045.84043
Magnesium (Mg)7439-95-40.000630.146000.07165
Nickel (Ni)7440-02-00.012532.913001.42954
Silicon (Si)7440-21-30.002710.631000.30966
MetallisationGold (Au)7440-57-50.000150.035000.01718
Nickel (Ni)7440-02-00.011852.755001.35200
Palladium (Pd)7440-05-30.000470.110000.05398
subTotal0.43000100.0000049.07444
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.71217
Silica fused60676-86-00.2220060.0000025.33610
Flame retardantMetal hydroxideProprietary0.011103.000001.26681
ImpurityBismuth (Bi)7440-69-90.001850.500000.21113
PigmentCarbon black1333-86-40.001850.500000.21113
PolymerEpoxy resin systemProprietary0.025907.000002.95588
Phenolic resinProprietary0.022206.000002.53361
subTotal0.37000100.0000042.22683
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00063
Tin solderTin (Sn)7440-31-50.0099999.940001.14058
subTotal0.01000100.000001.14126
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0062299.990000.71002
subTotal0.00622100.000000.71009
total0.87622100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.