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Chemical content PMBT2907AQA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMBT2907AQASOT1215DFN1010D-31.15353 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660462147212601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000331.000000.02861
FillerSilver (Ag)7440-22-40.0277284.000002.40306
PolymerBismaleimidodiphenylmethane resin 0.0033010.000000.28608
Isobornyl Methacrylate7534-94-30.001655.000000.14304
subTotal0.03300100.000002.86079
DieDoped siliconSilicon (Si)7440-21-30.05000100.000004.33452
subTotal0.05000100.000004.33452
Lead FrameCopper alloyCopper (Cu)7440-50-80.4787591.5400041.50340
Magnesium (Mg)7439-95-40.000890.170000.07708
Nickel (Ni)7440-02-00.014912.850001.29216
Silicon (Si)7440-21-30.003240.620000.28110
Pure metal layerGold (Au)7440-57-50.000370.070000.03174
Nickel (Ni)7440-02-00.022754.350001.97225
Palladium (Pd)7440-05-30.002090.400000.18136
subTotal0.52300100.0000045.33909
Mould CompoundFillerSilica -amorphous-7631-86-90.1177623.0000010.20866
Silica fused60676-86-00.3072060.0000026.63130
Flame retardantMetal hydroxideProprietary0.015363.000001.33156
ImpurityBismuth (Bi)7440-69-90.002560.500000.22193
PigmentCarbon black1333-86-40.002560.500000.22193
PolymerEpoxy resin systemProprietary0.035847.000003.10698
Phenolic resinProprietary0.030726.000002.66313
subTotal0.51200100.0000044.38549
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00011
Non hazardousProprietary0.000020.055500.00140
Tin solderTin (Sn)7440-31-50.0289899.940002.51251
subTotal0.02900100.000002.51402
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalGold (Au)7440-57-50.0065399.990000.56577
subTotal0.00653100.000000.56583
total1.15353100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.