×

Chemical content PMBT3906

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMBT3906SOT23TO-236AB7.68034 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337760102351712601235D-22529 HAMBURG, Germany; Melaka, Malaysia; Seremban, Malaysia; Dongguan, China 
9337760102151512601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China; Melaka, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06000100.000000.78122
subTotal0.06000100.000000.78122
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02987
Carbon (C)7440-44-00.001020.040000.01328
Chromium (Cr)7440-47-30.005610.220000.07301
Cobalt (Co)7440-48-40.010960.430000.14271
Iron (Fe)7439-89-61.2230147.9800015.92391
Manganese (Mn)7439-96-50.021920.860000.28542
Nickel (Ni)7440-02-00.9212136.1400011.99437
Phosphorus (P)7723-14-00.000510.020000.00664
Silicon (Si)7440-21-30.006630.260000.08629
Sulphur (S)7704-34-90.000510.020000.00664
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.77355
Silver (Ag)7440-22-40.065512.570000.85295
subTotal2.54900100.0000033.18864
Mould CompoundAdditiveNon hazardousProprietary0.141492.900001.84225
Triphenylphosphine603-35-00.002440.050000.03176
FillerSilica -amorphous-7631-86-93.5128872.0000045.73860
PigmentCarbon black1333-86-40.002440.050000.03176
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7318515.000009.52888
Phenol Formaldehyde resin (generic)9003-35-40.4879010.000006.35258
subTotal4.87900100.0000063.52583
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00007
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000010.005000.00012
Tin solderTin (Sn)7440-31-50.1849899.990002.40851
subTotal0.18500100.000002.40874
WirePure metalCopper (Cu)7440-50-80.00734100.000000.09555
subTotal0.00734100.000000.09555
total7.68034100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.