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Chemical content PMDPB95XNE2

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDPB95XNE2SOT1118HUSON67.15420 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068837115412601235Dongguan, China; Kwai Chung, Hong Kong; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01090
FillerSilver (Ag)7440-22-40.0655284.000000.91583
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10903
Isobornyl Methacrylate7534-94-30.003905.000000.05451
subTotal0.07800100.000001.09027
DieDoped siliconSilicon (Si)7440-21-30.30000100.000004.19334
subTotal0.30000100.000004.19334
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.77493
Magnesium (Mg)7439-95-40.005380.200000.07523
Nickel (Ni)7440-02-00.085303.170001.19237
Silicon (Si)7440-21-30.018570.690000.25954
Pure metal layerGold (Au)7440-57-50.000540.020000.00752
Nickel (Ni)7440-02-00.019910.740000.27835
Palladium (Pd)7440-05-30.001880.070000.02633
subTotal2.69100100.0000037.61427
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.49951
Silica fused60676-86-02.3328060.0000032.60742
Flame retardantMetal hydroxideProprietary0.116643.000001.63037
ImpurityBismuth (Bi)7440-69-90.019440.500000.27173
PigmentCarbon black1333-86-40.019440.500000.27173
PolymerEpoxy resin systemProprietary0.272167.000003.80420
Phenolic resinProprietary0.233286.000003.26074
subTotal3.88800100.0000054.34570
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1639099.940002.29098
subTotal0.16400100.000002.29235
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0332099.990000.46402
subTotal0.03320100.000000.46407
total7.15420100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.