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Chemical content PMEG045T100EPE

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Type numberPackagePackage descriptionTotal product weight
PMEG045T100EPESOT1289BCFP1573.20000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661646139212601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.59000100.000002.17213
subTotal1.59000100.000002.17213
ClipCopper alloyCopper (Cu)7440-50-87.3460299.8100010.03554
Iron (Fe)7439-89-60.011040.150000.01508
Phosphorus (P)7723-14-00.002940.040000.00402
subTotal7.36000100.0000010.05464
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600047.02424
Iron (Fe)7439-89-60.034470.100000.04709
Phosphorus (P)7723-14-00.013790.040000.01884
subTotal34.47000100.0000047.09017
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.82240
Silica fused60676-86-015.4950075.0000021.16803
PigmentCarbon black1333-86-40.061980.300000.08467
PolymerEpoxy resin systemProprietary1.590827.700002.17325
Phenolic resinProprietary1.446207.000001.97568
subTotal20.66000100.0000028.22403
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12294
subTotal0.09000100.000000.12295
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.78094
Silver alloySilver (Ag)7440-22-40.225752.500000.30840
Tin alloyTin (Sn)7440-31-50.180602.000000.24672
subTotal9.03000100.0000012.33606
total73.20000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.