Chemical content PMEG045V050EPE-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG045V050EPE-QSOT1289BCFP1573.05300 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934664811139312601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.44300100.000001.97528
ClipCopper alloyPhosphorus (P)7723-14-00.002940.040000.00403
Copper (Cu)7440-50-87.3460299.8100010.05573
Iron (Fe)7439-89-60.011040.150000.01511
Lead FrameCopper alloyPhosphorus (P)7723-14-00.013790.040000.01887
Iron (Fe)7439-89-60.034470.100000.04718
Copper (Cu)7440-50-834.4217499.8600047.11886
Mould CompoundFillerSilica fused60676-86-015.4950075.0000021.21063
Silica -amorphous-7631-86-92.0660010.000002.82808
PigmentCarbon black1333-86-40.061980.300000.08484
PolymerPhenolic resinProprietary1.446207.000001.97966
Epoxy resin systemProprietary1.590827.700002.17762
Post-PlatingImpurityCopper (Cu)7440-50-80.000000.001000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Antimony (Sb)7440-36-00.000000.003000.00000
Tin solderTin (Sn)7440-31-50.0899999.990000.12319
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.80465
Silver alloySilver (Ag)7440-22-40.225752.500000.30902
Tin alloyTin (Sn)7440-31-50.180602.000000.24722
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.