Chemical content PMEG045V150EPE-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG045V150EPE-QSOT1289BCFP1577.89600 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934664813139312601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.86600100.000003.67926
ClipCopper alloyCopper (Cu)7440-50-810.7657799.8680013.82070
Iron (Fe)7439-89-60.010560.098000.01356
Phosphorus (P)7723-14-00.003670.034000.00471
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600044.18936
Iron (Fe)7439-89-60.034470.100000.04425
Phosphorus (P)7723-14-00.013790.040000.01770
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.65225
Silica fused60676-86-015.4950075.0000019.89191
PigmentCarbon black1333-86-40.061980.300000.07957
PolymerEpoxy resin systemProprietary1.590827.700002.04224
Phenolic resinProprietary1.446207.000001.85658
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.11553
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.07072
Silver alloySilver (Ag)7440-22-40.225752.500000.28981
Tin alloyTin (Sn)7440-31-50.180602.000000.23185
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.