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Chemical content PMEG060T030ELPE-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG060T030ELPE-QSOT1289BCFP1572.44700 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662716139112601235Nijmegen, Netherlands; D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.83700100.000001.15533
subTotal0.83700100.000001.15533
ClipCopper alloyCopper (Cu)7440-50-87.3482299.8400010.14290
Iron (Fe)7439-89-60.011040.150000.01524
MetallisationCopper (Cu)7440-50-80.000740.010000.00102
subTotal7.36000100.0000010.15916
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600047.51300
Iron (Fe)7439-89-60.034470.100000.04758
Phosphorus (P)7723-14-00.013790.040000.01903
subTotal34.47000100.0000047.57961
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.85174
Silica fused60676-86-015.4950075.0000021.38805
PigmentCarbon black1333-86-40.061980.300000.08555
PolymerEpoxy resin systemProprietary1.590827.700002.19584
Phenolic resinProprietary1.446207.000001.99622
subTotal20.66000100.0000028.51740
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12422
subTotal0.09000100.000000.12423
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.90339
Silver alloySilver (Ag)7440-22-40.225752.500000.31161
Tin alloyTin (Sn)7440-31-50.180602.000000.24929
subTotal9.03000100.0000012.46429
total72.44700100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.