Chemical content PMEG060T040CLPE-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG060T040CLPE-QSOT1289BCFP1573.65200 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346628181393126030 s123520 s3D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.08200100.000001.46907
ClipCopper alloyCopper (Cu)7440-50-88.3066999.8400011.27829
Iron (Fe)7439-89-60.009980.120000.01356
Phosphorus (P)7723-14-00.002500.030000.00339
MetallisationCopper (Cu)7440-50-80.000830.010000.00113
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600046.73565
Iron (Fe)7439-89-60.034470.100000.04680
Phosphorus (P)7723-14-00.013790.040000.01872
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.80508
Silica fused60676-86-015.4950075.0000021.03813
PigmentCarbon black1333-86-40.061980.300000.08415
PolymerEpoxy resin systemProprietary1.590827.700002.15991
Phenolic resinProprietary1.446207.000001.96356
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12218
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.70864
Silver alloySilver (Ag)7440-22-40.225752.500000.30651
Tin alloyTin (Sn)7440-31-50.180602.000000.24521
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.