Chemical content PMEG060T080CLPE-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG060T080CLPE-QSOT1289BCFP1576.54900 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346627191391126030 s123520 s3Nijmegen, Netherlands; D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.61900100.000002.11499
ClipCopper alloyCopper (Cu)7440-50-810.6629199.8400013.92952
Iron (Fe)7439-89-60.012820.120000.01674
Phosphorus (P)7723-14-00.003200.030000.00419
MetallisationCopper (Cu)7440-50-80.001070.010000.00140
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600044.96694
Iron (Fe)7439-89-60.034470.100000.04503
Phosphorus (P)7723-14-00.013790.040000.01801
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.69892
Silica fused60676-86-015.4950075.0000020.24194
PigmentCarbon black1333-86-40.061980.300000.08097
PolymerEpoxy resin systemProprietary1.590827.700002.07817
Phenolic resinProprietary1.446207.000001.88925
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.11756
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.26553
Silver alloySilver (Ag)7440-22-40.225752.500000.29491
Tin alloyTin (Sn)7440-31-50.180602.000000.23593
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.