Chemical content PMEG060V100EPE

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Type numberPackagePackage descriptionTotal product weight
PMEG060V100EPESOT1289BCFP1577.45200 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662463139212601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.42200100.000003.12710
ClipCopper alloyCopper (Cu)7440-50-810.7657799.8680013.89993
Iron (Fe)7439-89-60.010560.098000.01364
Phosphorus (P)7723-14-00.003670.034000.00473
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600044.44268
Iron (Fe)7439-89-60.034470.100000.04450
Phosphorus (P)7723-14-00.013790.040000.01780
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.66746
Silica fused60676-86-015.4950075.0000020.00594
PigmentCarbon black1333-86-40.061980.300000.08002
PolymerEpoxy resin systemProprietary1.590827.700002.05394
Phenolic resinProprietary1.446207.000001.86722
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.11619
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.13419
Silver alloySilver (Ag)7440-22-40.225752.500000.29147
Tin alloyTin (Sn)7440-31-50.180602.000000.23318
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.