Chemical content PMEG100T030ELPE-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG100T030ELPE-QSOT1289BCFP1572.69000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662687139212601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.08000100.000001.48576
ClipCopper alloyCopper (Cu)7440-50-87.3482299.8400010.10899
Iron (Fe)7439-89-60.011040.150000.01519
MetallisationCopper (Cu)7440-50-80.000740.010000.00101
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600047.35416
Iron (Fe)7439-89-60.034470.100000.04742
Phosphorus (P)7723-14-00.013790.040000.01897
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.84221
Silica fused60676-86-015.4950075.0000021.31655
PigmentCarbon black1333-86-40.061980.300000.08527
PolymerEpoxy resin systemProprietary1.590827.700002.18850
Phenolic resinProprietary1.446207.000001.98954
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12380
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.86360
Silver alloySilver (Ag)7440-22-40.225752.500000.31057
Tin alloyTin (Sn)7440-31-50.180602.000000.24845
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.