Chemical content PMEG100T100ELPE

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Type numberPackagePackage descriptionTotal product weight
PMEG100T100ELPESOT1289BCFP1573.74000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934661559139312601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.13000100.000002.88853
ClipCopper alloyCopper (Cu)7440-50-87.3460299.810009.96205
Iron (Fe)7439-89-60.011040.150000.01497
Phosphorus (P)7723-14-00.002940.040000.00399
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600046.67988
Iron (Fe)7439-89-60.034470.100000.04675
Phosphorus (P)7723-14-00.013790.040000.01870
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.80174
Silica fused60676-86-015.4950075.0000021.01302
PigmentCarbon black1333-86-40.061980.300000.08405
PolymerEpoxy resin systemProprietary1.590827.700002.15734
Phenolic resinProprietary1.446207.000001.96122
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12204
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.69467
Silver alloySilver (Ag)7440-22-40.225752.500000.30614
Tin alloyTin (Sn)7440-31-50.180602.000000.24491
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.