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Chemical content PMEG100T10ELXD-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG100T10ELXD-QSOD323HPSO26.64000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346629421155126030 s123520 s3D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.19000100.000002.86145
subTotal0.19000100.000002.86145
ClipCopper alloyCopper (Cu)7440-50-81.0455097.7100015.74544
Iron (Fe)7439-89-60.022792.130000.34324
Phosphorus (P)7723-14-00.000320.030000.00483
Zinc (Zn)7440-66-60.001390.130000.02095
subTotal1.07000100.0000016.11446
Lead FrameCopper alloyCopper (Cu)7440-50-82.4767899.8700037.30084
Iron (Fe)7439-89-60.002230.090000.03361
Phosphorus (P)7723-14-00.000990.040000.01494
subTotal2.48000100.0000037.34939
Mould CompoundFillerSilica -amorphous-7631-86-90.2470010.000003.71988
Silica fused60676-86-01.8525075.0000027.89910
PigmentCarbon black1333-86-40.007410.300000.11160
PolymerEpoxy resin systemProprietary0.190197.700002.86431
Phenolic resinProprietary0.172907.000002.60392
subTotal2.47000100.0000037.19881
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00009
Bismuth (Bi)7440-69-90.000000.001000.00003
Copper (Cu)7440-50-80.000000.001000.00003
Lead (Pb)7439-92-10.000010.005000.00016
Tin solderTin (Sn)7440-31-50.2099899.990003.16233
subTotal0.21000100.000003.16264
Solder PasteImpurityAntimony (Sb)7440-36-00.000070.030000.00099
Lead alloyLead (Pb)7439-92-10.2034392.470003.06377
Silver (Ag)7440-22-40.005502.500000.08283
Tin (Sn)7440-31-50.011005.000000.16566
subTotal0.22000100.000003.31325
total6.64000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.