Chemical content PMEG100T10ELXD

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Type numberPackagePackage descriptionTotal product weight
PMEG100T10ELXDSOD323HPSO26.64000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662486115312601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.19000100.000002.86145
ClipCopper alloyCopper (Cu)7440-50-81.0455097.7100015.74544
Iron (Fe)7439-89-60.022792.130000.34324
Phosphorus (P)7723-14-00.000320.030000.00483
Zinc (Zn)7440-66-60.001390.130000.02095
Lead FrameCopper alloyCopper (Cu)7440-50-82.4767899.8700037.30084
Iron (Fe)7439-89-60.002230.090000.03361
Phosphorus (P)7723-14-00.000990.040000.01494
Mould CompoundFillerSilica -amorphous-7631-86-90.2470010.000003.71988
Silica fused60676-86-01.8525075.0000027.89910
PigmentCarbon black1333-86-40.007410.300000.11160
PolymerEpoxy resin systemProprietary0.190197.700002.86431
Phenolic resinProprietary0.172907.000002.60392
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00009
Bismuth (Bi)7440-69-90.000000.001000.00003
Copper (Cu)7440-50-80.000000.001000.00003
Lead (Pb)7439-92-10.000010.005000.00016
Tin solderTin (Sn)7440-31-50.2099899.990003.16233
Solder PasteImpurityAntimony (Sb)7440-36-00.000070.030000.00099
Lead alloyLead (Pb)7439-92-10.2034392.470003.06377
Silver (Ag)7440-22-40.005502.500000.08283
Tin (Sn)7440-31-50.011005.000000.16566
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.