Chemical content PMEG100T150ELPE

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Type numberPackagePackage descriptionTotal product weight
PMEG100T150ELPESOT1289BCFP1578.06000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346615621394126030 s123520 s3D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.03000100.000003.88163
ClipCopper alloyCopper (Cu)7440-50-810.7657799.8680013.79166
Iron (Fe)7439-89-60.010560.098000.01353
Phosphorus (P)7723-14-00.003670.034000.00470
Lead FrameCopper alloyCopper (Cu)7440-50-834.4217499.8600044.09652
Iron (Fe)7439-89-60.034470.100000.04416
Phosphorus (P)7723-14-00.013790.040000.01766
Mould CompoundFillerSilica -amorphous-7631-86-92.0660010.000002.64668
Silica fused60676-86-015.4950075.0000019.85012
PigmentCarbon black1333-86-40.061980.300000.07940
PolymerEpoxy resin systemProprietary1.590827.700002.03795
Phenolic resinProprietary1.446207.000001.85268
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.11528
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.04746
Silver alloySilver (Ag)7440-22-40.225752.500000.28920
Tin alloyTin (Sn)7440-31-50.180602.000000.23136
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.