Chemical content PMEG100T50ELP-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG100T50ELP-QSOD128FlatPower32.87700 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662816115312601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.78000100.000002.37248
ClipCopper alloyCopper (Cu)7440-50-85.2097099.8600015.84602
Iron (Fe)7439-89-60.005220.100000.01587
Phosphorus (P)7723-14-00.002090.040000.00635
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200035.38414
Iron (Fe)7439-89-60.011820.100000.03595
Phosphorus (P)7723-14-00.003550.030000.01079
Pure metal layerSilver (Ag)7440-22-40.171391.450000.52131
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.71384
Silica fused60676-86-09.1575075.0000027.85382
PigmentCarbon black1333-86-40.036630.300000.11142
PolymerEpoxy resin systemProprietary0.940177.700002.85966
Phenolic resinProprietary0.854707.000002.59969
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.06447
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500007.03379
Silver alloySilver (Ag)7440-22-40.062502.500000.19010
Tin alloyTin (Sn)7440-31-50.125005.000000.38021
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.