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Chemical content PMEG100V080ELPD

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Type numberPackagePackage descriptionTotal product weight
PMEG100V080ELPDSOT1289CFP1573.07000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069521139412601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
934069521146612601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.46000100.000001.99808
subTotal1.46000100.000001.99808
ClipCopper alloyCopper (Cu)7440-50-87.3460299.8100010.05340
Iron (Fe)7439-89-60.011040.150000.01511
Phosphorus (P)7723-14-00.002940.040000.00403
subTotal7.36000100.0000010.07254
Lead FrameCopper alloyCopper (Cu)7440-50-833.8529998.2100046.32953
Iron (Fe)7439-89-60.003450.010000.00472
Phosphorus (P)7723-14-00.013790.040000.01887
Pure metal layerCopper (Cu)7440-50-80.027580.080000.03774
Silver (Ag)7440-22-40.572201.660000.78309
subTotal34.47000100.0000047.17395
Mould CompoundFillerSilica fused60676-86-014.6686071.0000020.07472
PigmentCarbon black1333-86-40.061980.300000.08482
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.0700219.700005.57003
Phenolic resinProprietary1.859409.000002.54468
subTotal20.66000100.0000028.27425
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00000
Bismuth (Bi)7440-69-90.000000.001000.00000
Copper (Cu)7440-50-80.000000.001000.00000
Lead (Pb)7439-92-10.000000.005000.00001
Tin solderTin (Sn)7440-31-50.0899999.990000.12316
subTotal0.09000100.000000.12317
Solder PasteLead alloyLead (Pb)7439-92-18.6236595.5000011.80190
Silver alloySilver (Ag)7440-22-40.225752.500000.30895
Tin alloyTin (Sn)7440-31-50.180602.000000.24716
subTotal9.03000100.0000012.35801
total73.07000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.