Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG2005EGW-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2005EGW-QSOD123SOD212.17330 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664902118112601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
934664902115112601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.12000100.000000.98576
subTotal0.12000100.000000.98576
Lead FrameCopper alloyCopper (Cu)7440-50-83.5331894.4700029.02400
Iron (Fe)7439-89-60.077792.080000.63904
Phosphorus (P)7723-14-00.001500.040000.01229
Zinc (Zn)7440-66-60.004860.130000.03994
Pure metal layerCopper (Cu)7440-50-80.062461.670000.51307
Silver (Ag)7440-22-40.060211.610000.49464
subTotal3.74000100.0000030.72298
Mould CompoundAdditiveNon hazardousProprietary0.234032.900001.92249
Triphenylphosphine603-35-00.004040.050000.03315
FillerSilica -amorphous-7631-86-95.8104072.0000047.73069
PigmentCarbon black1333-86-40.004040.050000.03315
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2105015.000009.94389
Phenol Formaldehyde resin (generic)9003-35-40.8070010.000006.62926
subTotal8.07000100.0000066.29263
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00008
Non hazardousProprietary0.000120.055500.00096
Tin solderTin (Sn)7440-31-50.2098799.940001.72405
subTotal0.21000100.000001.72509
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0332599.990000.27311
subTotal0.03325100.000000.27314
total12.17330100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.