×

Chemical content PMEG2005EH-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2005EH-QSOD123FSOD29.90548 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663932115212601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.12000100.000001.21145
subTotal0.12000100.000001.21145
Lead FrameCopper alloyCopper (Cu)7440-50-82.8091796.8680028.35978
Iron (Fe)7439-89-60.061772.130000.62359
Phosphorus (P)7723-14-00.000870.030000.00878
Zinc (Zn)7440-66-60.003770.130000.03806
MetallisationSilver (Ag)7440-22-40.031611.090000.31912
Pure metal layerSilver (Ag)7440-22-40.023780.820000.24007
subTotal2.90000100.0000029.58940
Mould CompoundFillerSilica fused60676-86-04.7712071.0000048.16728
PigmentCarbon black1333-86-40.020160.300000.20352
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.3238419.7000013.36472
Phenolic resinProprietary0.604809.000006.10571
subTotal6.72000100.0000067.84123
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00005
Non hazardousProprietary0.000070.055500.00067
Tin solderTin (Sn)7440-31-50.1199399.940001.21072
subTotal0.12000100.000001.21144
WirePure metalGold (Au)7440-57-50.04548100.000000.45914
subTotal0.04548100.000000.45914
total9.90548100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.