Bipolar transistors


ESD protection, TVS, filtering and signal conditioning





Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG2005EPK-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2005EPK-QSOD1608SOD16081.77904 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
9346665443151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000201.000000.01124
FillerSilver (Ag)7440-22-40.0168084.000000.94433
PolymerBismaleimidodiphenylmethane resin 0.0020010.000000.11242
Isobornyl Methacrylate7534-94-30.001005.000000.05621
DieDoped siliconSilicon (Si)7440-21-30.04000100.000002.24840
Lead FrameCopper alloyCopper (Cu)7440-50-80.9970393.1800056.04292
Magnesium (Mg)7439-95-40.001500.140000.08420
Nickel (Ni)7440-02-00.031032.900001.74420
Silicon (Si)7440-21-30.006740.630000.37891
Pure metal layerGold (Au)7440-57-50.000540.050000.03007
Nickel (Ni)7440-02-00.030282.830001.70210
Palladium (Pd)7440-05-30.002890.270000.16239
Mould CompoundFillerSilica -amorphous-7631-86-90.1242023.000006.98129
Silica fused60676-86-00.3240060.0000018.21207
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.016203.000000.91060
Ion trapping agentBismuth (Bi)7440-69-90.002700.500000.15177
PigmentCarbon black1333-86-40.002700.500000.15177
PolymerEpoxy resin systemProprietary0.037807.000002.12474
Phenolic resinProprietary0.032406.000001.82121
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00023
Non hazardousProprietary0.000050.055500.00281
Tin solderTin (Sn)7440-31-50.0899599.940005.05587
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0190499.990001.07013
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.