Chemical content PMEG2010BER-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG2010BER-QSOD123WSOD216.60600 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662912115112601235Suzhou, China; Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.36900100.000002.22209
ClipCopper alloyIron (Fe)7439-89-60.003820.120000.02298
Phosphorus (P)7723-14-00.000950.030000.00574
Copper (Cu)7440-50-83.1752399.8500019.12098
Lead FrameCopper alloyIron (Fe)7439-89-60.005310.098000.03199
Copper (Cu)7440-50-85.4125799.8630032.59409
Phosphorus (P)7723-14-00.001950.036000.01175
Pure metal layerCopper (Cu)7440-50-80.000160.003000.00098
Mould CompoundFillerSilica -amorphous-7631-86-90.6930010.000004.17319
Silica fused60676-86-05.1975075.0000031.29893
PigmentCarbon black1333-86-40.020790.300000.12520
PolymerPhenolic resinProprietary0.485107.000002.92123
Epoxy resin systemProprietary0.533617.700003.21336
Post-PlatingImpurityCopper (Cu)7440-50-80.000000.001000.00001
Bismuth (Bi)7440-69-90.000000.001000.00001
Lead (Pb)7439-92-10.000000.005000.00003
Antimony (Sb)7440-36-00.000000.003000.00002
Tin solderTin (Sn)7440-31-50.0999999.990000.60213
Solder PasteLead alloyLead (Pb)7439-92-10.5614892.500003.38116
Silver alloySilver (Ag)7440-22-40.015182.500000.09138
Tin alloyTin (Sn)7440-31-50.030355.000000.18277
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.