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Chemical content PMEG2010EA

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Type numberPackagePackage descriptionTotal product weight
PMEG2010EASOD323SOD24.18101 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934057100145212601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
934057100135512601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
9340571001151512601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07000100.000001.67424
subTotal0.07000100.000001.67424
Lead FrameCopper alloyCopper (Cu)7440-50-81.2165195.0400029.09613
Iron (Fe)7439-89-60.032642.550000.78067
Lead (Pb)7439-92-10.000380.030000.00918
Phosphorus (P)7723-14-00.001920.150000.04592
Zinc (Zn)7440-66-60.002560.200000.06123
Pure metal layerSilver (Ag)7440-22-40.025982.030000.62148
subTotal1.28000100.0000030.61461
Mould CompoundFillerSilica fused60676-86-02.0137375.1000048.16383
PigmentCarbon black1333-86-40.008040.300000.19240
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4692517.5000011.22326
Phenol Formaldehyde resin (generic)9003-35-40.190387.100004.55344
subTotal2.68140100.0000064.13293
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00014
Non hazardousProprietary0.000070.055500.00177
Tin solderTin (Sn)7440-31-50.1332599.940003.18712
subTotal0.13333100.000003.18903
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0162799.990000.38922
subTotal0.01628100.000000.38926
total4.18101100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.