Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG2010EPA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2010EPASOT1061HUSON37.663450 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93406348411510126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.148308
PolymerAcrylic resinProprietary0.02200020.0000000.287077
subTotal0.110000100.0000001.435385
DieDoped siliconSilicon (Si)7440-21-30.310000100.0000004.045175
subTotal0.310000100.0000004.045175
Lead FrameCopper alloyCopper (Cu)7440-50-82.58001492.94000033.666487
Magnesium (Mg)7439-95-40.0047190.1700000.061581
Nickel (Ni)7440-02-00.0860563.1000001.122941
Silicon (Si)7440-21-30.0194320.7000000.253567
Pure metal layerGold (Au)7440-57-50.0011100.0400000.014490
Nickel (Ni)7440-02-00.0774502.7900001.010647
Palladium (Pd)7440-05-30.0072180.2600000.094182
subTotal2.776000100.00000036.223894
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.227913
FillerSilica -amorphous-7631-86-90.0123540.2900000.161207
Silica fused60676-86-03.66999086.15000047.889528
HardenerPhenolic resinProprietary0.1827544.2900002.384748
PigmentCarbon black1333-86-40.0080940.1900000.105618
PolymerEpoxy resin systemProprietary0.3693428.6700004.819526
subTotal4.260000100.00000055.588540
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000100
Non hazardousProprietary0.0000940.0555000.001231
Tin solderTin (Sn)7440-31-50.16989899.9400002.216991
subTotal0.170000100.0000002.218322
WireImpurityNon hazardousProprietary0.0000040.0100000.000049
Pure metalCopper (Cu)7440-50-80.03744699.9900000.488634
subTotal0.037450100.0000000.488683
total7.663450100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.