Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG2020CPAS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2020CPASSOT1061DHUSON37.956906 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340681481153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08800080.0000001.105958
PolymerAcrylic resinProprietary0.02200020.0000000.276489
subTotal0.110000100.0000001.382447
DieDoped siliconSilicon (Si)7440-21-30.590000100.0000007.414942
subTotal0.590000100.0000007.414942
Lead FrameCopper alloyCopper (Cu)7440-50-82.63127493.84000033.069055
Magnesium (Mg)7439-95-40.0140200.5000000.176199
Nickel (Ni)7440-02-00.1037483.7000001.303874
Silicon (Si)7440-21-30.0224320.8000000.281919
Pure metal layerGold (Au)7440-57-50.0016820.0600000.021144
Nickel (Ni)7440-02-00.0280401.0000000.352398
Palladium (Pd)7440-05-30.0028040.1000000.035240
subTotal2.804000100.00000035.239828
Mould CompoundAdditiveNon hazardousProprietary0.0174660.4100000.219507
FillerSilica -amorphous-7631-86-90.0123540.2900000.155261
Silica fused60676-86-03.66999086.15000046.123330
HardenerPhenolic resinProprietary0.1827544.2900002.296797
PigmentCarbon black1333-86-40.0080940.1900000.101723
PolymerEpoxy resin systemProprietary0.3693428.6700004.641779
subTotal4.260000100.00000053.538398
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000096
Non hazardousProprietary0.0000940.0555000.001186
Tin solderTin (Sn)7440-31-50.16989899.9400002.135227
subTotal0.170000100.0000002.136509
WireImpurityNon hazardousProprietary0.0000020.0100000.000029
Pure metalCopper (Cu)7440-50-80.02290399.9900000.287844
subTotal0.022906100.0000000.287873
total7.956906100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.