Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG3002AELD-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG3002AELD-QSOD882DDFN1006-20.660640 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346649123151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.345120
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.047545
Phenolic resinProprietary0.00040613.5300000.061440
subTotal0.003000100.0000000.454105
DieDoped siliconSilicon (Si)7440-21-30.020000100.0000003.027367
subTotal0.020000100.0000003.027367
Lead FrameCopper alloyChromium (Cr)7440-47-30.0008030.2575000.121609
Copper (Cu)7440-50-80.29576094.79500044.768770
Tin (Sn)7440-31-50.0007450.2388000.112778
Zinc (Zn)7440-66-60.0005950.1908000.090109
Pure metal layerGold (Au)7440-57-50.0001720.0550000.025975
Nickel (Ni)7440-02-00.0133914.2920002.026980
Palladium (Pd)7440-05-30.0005330.1709000.080711
subTotal0.312000100.00000047.226931
Mould CompoundFillerSilica -amorphous-7631-86-90.06877023.00000010.409603
Silica fused60676-86-00.17940060.00000027.155486
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0089703.0000001.357774
Ion trapping agentBismuth (Bi)7440-69-90.0014950.5000000.226296
PigmentCarbon black1333-86-40.0014950.5000000.226296
PolymerEpoxy resin systemProprietary0.0209307.0000003.168140
Phenolic resinProprietary0.0179406.0000002.715549
subTotal0.299000100.00000045.259143
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000150
Non hazardousProprietary0.0000120.0555000.001848
Tin solderTin (Sn)7440-31-50.02198799.9400003.328106
subTotal0.022000100.0000003.330104
WireImpurityNon hazardousProprietary0.0000000.0100000.000070
Pure metalGold (Au)7440-57-50.00464099.9900000.702279
subTotal0.004640100.0000000.702349
total0.660640100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.