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Chemical content PMEG3002AELD-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG3002AELD-QSOD882DDFN1006-20.66064 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664912315112601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.34512
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04754
Phenolic resinProprietary0.0004113.530000.06144
subTotal0.00300100.000000.45410
DieDoped siliconSilicon (Si)7440-21-30.02000100.000003.02737
subTotal0.02000100.000003.02737
Lead FrameCopper alloyChromium (Cr)7440-47-30.000800.257500.12161
Copper (Cu)7440-50-80.2957694.7950044.76877
Tin (Sn)7440-31-50.000750.238800.11278
Zinc (Zn)7440-66-60.000600.190800.09011
Pure metal layerGold (Au)7440-57-50.000170.055000.02597
Nickel (Ni)7440-02-00.013394.292002.02698
Palladium (Pd)7440-05-30.000530.170900.08071
subTotal0.31200100.0000047.22693
Mould CompoundFillerSilica -amorphous-7631-86-90.0687723.0000010.40960
Silica fused60676-86-00.1794060.0000027.15549
Flame retardantMetal hydroxideProprietary0.008973.000001.35777
ImpurityBismuth (Bi)7440-69-90.001500.500000.22630
PigmentCarbon black1333-86-40.001500.500000.22630
PolymerEpoxy resin systemProprietary0.020937.000003.16814
Phenolic resinProprietary0.017946.000002.71555
subTotal0.29900100.0000045.25915
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00015
Non hazardousProprietary0.000010.055500.00185
Tin solderTin (Sn)7440-31-50.0219999.940003.32811
subTotal0.02200100.000003.33011
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0046499.990000.70228
subTotal0.00464100.000000.70235
total0.66064100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.