Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMEG3020EP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG3020EPSOD128FlatPower34.060000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93406147211510126030 s123520 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.780000100.0000002.290076
subTotal0.780000100.0000002.290076
ClipCopper alloyCopper (Cu)7440-50-87.28052399.87000021.375581
Iron (Fe)7439-89-60.0072900.1000000.021403
Phosphorus (P)7723-14-00.0021870.0300000.006421
subTotal7.290000100.00000021.403406
Lead FrameCopper alloyCopper (Cu)7440-50-811.63324498.42000034.155150
Iron (Fe)7439-89-60.0118200.1000000.034703
Phosphorus (P)7723-14-00.0035460.0300000.010411
Pure metal layerSilver (Ag)7440-22-40.1713901.4500000.503200
subTotal11.820000100.00000034.703464
Mould CompoundFillerSilica fused60676-86-08.03720071.00000023.597181
PigmentCarbon black1333-86-40.0339600.3000000.099706
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.23004019.7000006.547387
Phenolic resinProprietary1.0188009.0000002.991192
subTotal11.320000100.00000033.235467
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000100.0030000.000031
Bismuth (Bi)7440-69-90.0000040.0010000.000010
Copper (Cu)7440-50-80.0000040.0010000.000010
Lead (Pb)7439-92-10.0000180.0050000.000051
Tin solderTin (Sn)7440-31-50.34996599.9900001.027496
subTotal0.350000100.0000001.027598
Solder PasteLead alloyLead (Pb)7439-92-12.31250092.5000006.789489
Silver (Ag)7440-22-40.0625002.5000000.183500
Tin (Sn)7440-31-50.1250005.0000000.366999
subTotal2.500000100.0000007.339988
total34.060000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.