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Chemical content PMEG3050EP

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Type numberPackagePackage descriptionTotal product weight
PMEG3050EPSOD128FlatPower34.52000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340614751151012601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.68000100.000004.86674
subTotal1.68000100.000004.86674
ClipCopper alloyCopper (Cu)7440-50-86.8411099.8700019.81777
Iron (Fe)7439-89-60.006850.100000.01984
Phosphorus (P)7723-14-00.002060.030000.00595
subTotal6.85000100.0000019.84356
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200033.70001
Iron (Fe)7439-89-60.011820.100000.03424
Phosphorus (P)7723-14-00.003550.030000.01027
Pure metal layerSilver (Ag)7440-22-40.171391.450000.49649
subTotal11.82000100.0000034.24101
Mould CompoundFillerSilica fused60676-86-08.0372071.0000023.28273
PigmentCarbon black1333-86-40.033960.300000.09838
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.2300419.700006.46014
Phenolic resinProprietary1.018809.000002.95133
subTotal11.32000100.0000032.79258
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.01380
subTotal0.35000100.000001.01390
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500006.69902
Silver alloySilver (Ag)7440-22-40.062502.500000.18105
Tin alloyTin (Sn)7440-31-50.125005.000000.36211
subTotal2.50000100.000007.24218
total34.52000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.