Chemical content PMEG4010CPAS

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Type numberPackagePackage descriptionTotal product weight
PMEG4010CPASSOT1061DHUSON37.95691 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934068146115412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01382
FillerSilver (Ag)7440-22-40.0924084.000001.16125
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.13824
Isobornyl Methacrylate7534-94-30.005505.000000.06912
DieDoped siliconSilicon (Si)7440-21-30.59000100.000007.41494
Lead FrameCopper alloyCopper (Cu)7440-50-82.6312793.8400033.06904
Magnesium (Mg)7439-95-40.014020.500000.17620
Nickel (Ni)7440-02-00.103753.700001.30387
Silicon (Si)7440-21-30.022430.800000.28192
Pure metal layerGold (Au)7440-57-50.001680.060000.02114
Nickel (Ni)7440-02-00.028041.000000.35240
Palladium (Pd)7440-05-30.002800.100000.03524
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.21951
FillerSilica -amorphous-7631-86-90.012350.290000.15526
Silica fused60676-86-03.6699986.1500046.12331
HardenerPhenolic resinProprietary0.182754.290002.29680
PigmentCarbon black1333-86-40.008090.190000.10172
PolymerEpoxy resin systemProprietary0.369348.670004.64178
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00119
Tin solderTin (Sn)7440-31-50.1699099.940002.13523
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0229099.990000.28784
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.