Chemical content PMEG4030ER-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG4030ER-QSOD123WSOD217.65000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662904115112601235Suzhou, China; D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.30000100.000007.36544
ClipCopper alloyCopper (Cu)7440-50-83.6852099.8700020.87934
Iron (Fe)7439-89-60.003690.100000.02091
Phosphorus (P)7723-14-00.001110.030000.00627
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100030.68369
Iron (Fe)7439-89-60.005520.100000.03127
Phosphorus (P)7723-14-00.001660.030000.00938
Pure metal layerSilver (Ag)7440-22-40.097151.760000.55044
Mould CompoundFillerSilica fused60676-86-04.4588071.0000025.26232
PigmentCarbon black1333-86-40.018840.300000.10674
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2371619.700007.00941
Phenolic resinProprietary0.565209.000003.20227
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00002
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00004
Tin solderTin (Sn)7440-31-50.1399999.990000.79312
Solder PasteLead alloyLead (Pb)7439-92-10.6660092.500003.77337
Silver alloySilver (Ag)7440-22-40.018002.500000.10198
Tin alloyTin (Sn)7440-31-50.036005.000000.20397
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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