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Chemical content PMEG4030ER-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG4030ER-QSOD123WSOD217.65000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662904115112601235Suzhou, China; D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.30000100.000007.36544
subTotal1.30000100.000007.36544
ClipCopper alloyCopper (Cu)7440-50-83.6852099.8700020.87934
Iron (Fe)7439-89-60.003690.100000.02091
Phosphorus (P)7723-14-00.001110.030000.00627
subTotal3.69000100.0000020.90652
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100030.68369
Iron (Fe)7439-89-60.005520.100000.03127
Phosphorus (P)7723-14-00.001660.030000.00938
Pure metal layerSilver (Ag)7440-22-40.097151.760000.55044
subTotal5.52000100.0000031.27478
Mould CompoundFillerSilica fused60676-86-04.4588071.0000025.26232
PigmentCarbon black1333-86-40.018840.300000.10674
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2371619.700007.00941
Phenolic resinProprietary0.565209.000003.20227
subTotal6.28000100.0000035.58074
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00002
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00004
Tin solderTin (Sn)7440-31-50.1399999.990000.79312
subTotal0.14000100.000000.79320
Solder PasteLead alloyLead (Pb)7439-92-10.6660092.500003.77337
Silver alloySilver (Ag)7440-22-40.018002.500000.10198
Tin alloyTin (Sn)7440-31-50.036005.000000.20397
subTotal0.72000100.000004.07932
total17.65000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.