Chemical content PMEG4050ETP-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG4050ETP-QSOD128FlatPower35.34000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662866115112601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.44300100.000004.08319
ClipCopper alloyCopper (Cu)7440-50-85.2097099.8600014.74164
Iron (Fe)7439-89-60.005220.100000.01476
Phosphorus (P)7723-14-00.002090.040000.00590
Lead FrameCopper alloyCopper (Cu)7440-50-812.0035399.8630033.96585
Iron (Fe)7439-89-60.012020.100000.03401
Phosphorus (P)7723-14-00.004450.037000.01258
Mould CompoundFillerSilica -amorphous-7631-86-91.3940010.000003.94454
Silica fused60676-86-010.4550075.0000029.58404
PigmentCarbon black1333-86-40.041820.300000.11834
PolymerEpoxy resin systemProprietary1.073387.700003.03729
Phenolic resinProprietary0.975807.000002.76118
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00002
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00003
Tin solderTin (Sn)7440-31-50.2199899.990000.62246
Solder PasteImpurityAntimony (Sb)7440-36-00.000750.030000.00212
Lead alloyLead (Pb)7439-92-12.3117592.470006.54145
Silver (Ag)7440-22-40.062502.500000.17685
Tin (Sn)7440-31-50.125005.000000.35371
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.