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Chemical content PMEG40T30ER

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Type numberPackagePackage descriptionTotal product weight
PMEG40T30ERSOD123WSOD216.96000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070414115212601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.61000100.000003.59670
subTotal0.61000100.000003.59670
ClipCopper alloyCopper (Cu)7440-50-83.6852099.8700021.72879
Iron (Fe)7439-89-60.003690.100000.02176
Phosphorus (P)7723-14-00.001110.030000.00653
subTotal3.69000100.0000021.75708
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100031.93203
Iron (Fe)7439-89-60.005520.100000.03255
Phosphorus (P)7723-14-00.001660.030000.00976
Pure metal layerSilver (Ag)7440-22-40.097151.760000.57283
subTotal5.52000100.0000032.54717
Mould CompoundFillerSilica fused60676-86-04.4588071.0000026.29009
PigmentCarbon black1333-86-40.018840.300000.11108
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2371619.700007.29458
Phenolic resinProprietary0.565209.000003.33255
subTotal6.28000100.0000037.02830
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00002
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00004
Tin solderTin (Sn)7440-31-50.1399999.990000.82539
subTotal0.14000100.000000.82547
Solder PasteLead alloyLead (Pb)7439-92-10.6660092.500003.92689
Silver alloySilver (Ag)7440-22-40.018002.500000.10613
Tin alloyTin (Sn)7440-31-50.036005.000000.21226
subTotal0.72000100.000004.24528
total16.96000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.