Chemical content PMEG45T20EXD

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Type numberPackagePackage descriptionTotal product weight
PMEG45T20EXDSOD323HPSO26.67200 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662445115312601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.22200100.000003.32734
ClipCopper alloyCopper (Cu)7440-50-81.0455097.7100015.66992
Iron (Fe)7439-89-60.022792.130000.34159
Phosphorus (P)7723-14-00.000320.030000.00481
Zinc (Zn)7440-66-60.001390.130000.02085
Lead FrameCopper alloyCopper (Cu)7440-50-82.4767899.8700037.12194
Iron (Fe)7439-89-60.002230.090000.03345
Phosphorus (P)7723-14-00.000990.040000.01487
Mould CompoundFillerSilica -amorphous-7631-86-90.2470010.000003.70204
Silica fused60676-86-01.8525075.0000027.76529
PigmentCarbon black1333-86-40.007410.300000.11106
PolymerEpoxy resin systemProprietary0.190197.700002.85057
Phenolic resinProprietary0.172907.000002.59143
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00009
Bismuth (Bi)7440-69-90.000000.001000.00003
Copper (Cu)7440-50-80.000000.001000.00003
Lead (Pb)7439-92-10.000010.005000.00016
Tin solderTin (Sn)7440-31-50.2099899.990003.14717
Solder PasteImpurityAntimony (Sb)7440-36-00.000070.030000.00099
Lead alloyLead (Pb)7439-92-10.2034392.470003.04907
Silver (Ag)7440-22-40.005502.500000.08243
Tin (Sn)7440-31-50.011005.000000.16487
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.