Chemical content PMEG6030CER-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG6030CER-QSOD123WSOD216.60600 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934666239115212601235D-22529 HAMBURG, Germany; Suzhou, China; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.36900100.000002.22209
ClipCopper alloyCopper (Cu)7440-50-83.1752399.8500019.12098
Iron (Fe)7439-89-60.003820.120000.02298
Phosphorus (P)7723-14-00.000950.030000.00574
Lead FrameCopper alloyCopper (Cu)7440-50-85.4125799.8630032.59409
Iron (Fe)7439-89-60.005310.098000.03199
Phosphorus (P)7723-14-00.001950.036000.01175
Pure metal layerCopper (Cu)7440-50-80.000160.003000.00098
Mould CompoundFillerSilica -amorphous-7631-86-90.6930010.000004.17319
Silica fused60676-86-05.1975075.0000031.29893
PigmentCarbon black1333-86-40.020790.300000.12520
PolymerEpoxy resin systemProprietary0.533617.700003.21336
Phenolic resinProprietary0.485107.000002.92123
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00002
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000000.005000.00003
Tin solderTin (Sn)7440-31-50.0999999.990000.60213
Solder PasteLead alloyLead (Pb)7439-92-10.5614892.500003.38116
Silver alloySilver (Ag)7440-22-40.015182.500000.09138
Tin alloyTin (Sn)7440-31-50.030355.000000.18277
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.