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Chemical content PMEG6045ETP

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Type numberPackagePackage descriptionTotal product weight
PMEG6045ETPSOD128FlatPower33.54000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067593115312601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.44300100.000004.30233
subTotal1.44300100.000004.30233
ClipCopper alloyCopper (Cu)7440-50-85.2098599.8630015.53325
Iron (Fe)7439-89-60.005160.099000.01540
Phosphorus (P)7723-14-00.001980.038000.00591
subTotal5.21700100.0000015.55456
Lead FrameCopper alloyCopper (Cu)7440-50-811.8046399.8700035.19569
Iron (Fe)7439-89-60.011230.095000.03348
Phosphorus (P)7723-14-00.004140.035000.01233
subTotal11.82000100.0000035.24150
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.64043
Silica fused60676-86-09.1575075.0000027.30322
PigmentCarbon black1333-86-40.036630.300000.10921
PolymerEpoxy resin systemProprietary0.940177.700002.80313
Phenolic resinProprietary0.854707.000002.54830
subTotal12.21000100.0000036.40429
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.04343
subTotal0.35000100.000001.04353
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500006.89475
Silver alloySilver (Ag)7440-22-40.062502.500000.18634
Tin alloyTin (Sn)7440-31-50.125005.000000.37269
subTotal2.50000100.000007.45378
total33.54000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.