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Chemical content PMEG60T10ELP

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Type numberPackagePackage descriptionTotal product weight
PMEG60T10ELPSOD128FlatPower32.50000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070874115512601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.40300100.000001.24000
subTotal0.40300100.000001.24000
ClipCopper alloyCopper (Cu)7440-50-85.2097099.8600016.02983
Iron (Fe)7439-89-60.005220.100000.01605
Phosphorus (P)7723-14-00.002090.040000.00642
subTotal5.21700100.0000016.05230
Lead FrameCopper alloyCopper (Cu)7440-50-811.6332498.4200035.79460
Iron (Fe)7439-89-60.011820.100000.03637
Phosphorus (P)7723-14-00.003550.030000.01091
Pure metal layerSilver (Ag)7440-22-40.171391.450000.52735
subTotal11.82000100.0000036.36923
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.75692
Silica fused60676-86-09.1575075.0000028.17692
PigmentCarbon black1333-86-40.036630.300000.11271
PolymerEpoxy resin systemProprietary0.940177.700002.89283
Phenolic resinProprietary0.854707.000002.62985
subTotal12.21000100.0000037.56923
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.07682
subTotal0.35000100.000001.07692
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500007.11538
Silver alloySilver (Ag)7440-22-40.062502.500000.19231
Tin alloyTin (Sn)7440-31-50.125005.000000.38462
subTotal2.50000100.000007.69231
total32.50000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.