Chemical content PMEG60T20ELXD-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG60T20ELXD-QSOD323HPSO26.68800 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662941115412601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.23800100.000003.55861
ClipCopper alloyCopper (Cu)7440-50-81.0455097.7100015.63243
Iron (Fe)7439-89-60.022792.130000.34077
Phosphorus (P)7723-14-00.000320.030000.00480
Zinc (Zn)7440-66-60.001390.130000.02080
Lead FrameCopper alloyCopper (Cu)7440-50-82.4767899.8700037.03313
Iron (Fe)7439-89-60.002230.090000.03337
Phosphorus (P)7723-14-00.000990.040000.01483
Mould CompoundFillerSilica -amorphous-7631-86-90.2470010.000003.69318
Silica fused60676-86-01.8525075.0000027.69886
PigmentCarbon black1333-86-40.007410.300000.11080
PolymerEpoxy resin systemProprietary0.190197.700002.84375
Phenolic resinProprietary0.172907.000002.58523
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00009
Bismuth (Bi)7440-69-90.000000.001000.00003
Copper (Cu)7440-50-80.000000.001000.00003
Lead (Pb)7439-92-10.000010.005000.00016
Tin solderTin (Sn)7440-31-50.2099899.990003.13964
Solder PasteImpurityAntimony (Sb)7440-36-00.000070.030000.00099
Lead alloyLead (Pb)7439-92-10.2034392.470003.04178
Silver (Ag)7440-22-40.005502.500000.08224
Tin (Sn)7440-31-50.011005.000000.16447
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.