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Chemical content PMN16XNE

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Type numberPackagePackage descriptionTotal product weight
PMN16XNESOT457SC-7412.75350 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069603115412601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0523677.000000.41055
PolymerResin systemProprietary0.0156423.000000.12263
subTotal0.06800100.000000.53318
DieDoped siliconSilicon (Si)7440-21-30.31000100.000002.43071
subTotal0.31000100.000002.43071
Lead FrameCopper alloyCopper (Cu)7440-50-84.5044095.1700035.31890
Iron (Fe)7439-89-60.107442.270000.84243
Phosphorus (P)7723-14-00.003310.070000.02598
Zinc (Zn)7440-66-60.005680.120000.04453
Pure metal layerSilver (Ag)7440-22-40.112172.370000.87954
subTotal4.73300100.0000037.11138
Mould CompoundAdditiveNon hazardousProprietary0.029010.410000.22748
FillerSilica -amorphous-7631-86-90.020520.290000.16090
Silica fused60676-86-06.0959786.1500047.79844
HardenerPhenolic resinProprietary0.303564.290002.38021
PigmentCarbon black1333-86-40.013440.190000.10542
PolymerEpoxy resin systemProprietary0.613498.670004.81036
subTotal7.07600100.0000055.48281
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000270.055500.00211
Tin solderTin (Sn)7440-31-50.4857199.940003.80843
subTotal0.48600100.000003.81071
WireImpurityNon hazardousProprietary0.000010.010000.00006
Pure metalCopper (Cu)7440-50-80.0804999.990000.63114
subTotal0.08050100.000000.63120
total12.75350100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.