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Chemical content PMN30UNE

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Type numberPackagePackage descriptionTotal product weight
PMN30UNESOT457SC-7412.55486 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069604115412601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0523677.000000.41705
PolymerResin systemProprietary0.0156423.000000.12457
subTotal0.06800100.000000.54162
DieDoped siliconSilicon (Si)7440-21-30.16000100.000001.27441
subTotal0.16000100.000001.27441
Lead FrameCopper alloyCopper (Cu)7440-50-84.5044095.1700035.87771
Iron (Fe)7439-89-60.107442.270000.85576
Phosphorus (P)7723-14-00.003310.070000.02639
Zinc (Zn)7440-66-60.005680.120000.04524
Pure metal layerSilver (Ag)7440-22-40.112172.370000.89346
subTotal4.73300100.0000037.69856
Mould CompoundAdditiveNon hazardousProprietary0.029010.410000.23108
FillerSilica -amorphous-7631-86-90.020520.290000.16345
Silica fused60676-86-06.0959786.1500048.55470
HardenerPhenolic resinProprietary0.303564.290002.41787
PigmentCarbon black1333-86-40.013440.190000.10709
PolymerEpoxy resin systemProprietary0.613498.670004.88647
subTotal7.07600100.0000056.36066
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000270.055500.00215
Tin solderTin (Sn)7440-31-50.4857199.940003.86869
subTotal0.48600100.000003.87101
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0318699.990000.25373
subTotal0.03186100.000000.25376
total12.55486100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.