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Chemical content PMN30XP

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Type numberPackagePackage descriptionTotal product weight
PMN30XPSOT457SC-7412.76085 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070095115412601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0523677.000000.41032
PolymerResin systemProprietary0.0156423.000000.12256
subTotal0.06800100.000000.53288
DieDoped siliconSilicon (Si)7440-21-30.31000100.000002.42931
subTotal0.31000100.000002.42931
Lead FrameCopper alloyCopper (Cu)7440-50-84.5044095.1700035.29856
Iron (Fe)7439-89-60.107442.270000.84194
Phosphorus (P)7723-14-00.003310.070000.02596
Zinc (Zn)7440-66-60.005680.120000.04451
Pure metal layerSilver (Ag)7440-22-40.112172.370000.87903
subTotal4.73300100.0000037.09000
Mould CompoundAdditiveNon hazardousProprietary0.029010.410000.22735
FillerSilica -amorphous-7631-86-90.020520.290000.16081
Silica fused60676-86-06.0959786.1500047.77091
HardenerPhenolic resinProprietary0.303564.290002.37884
PigmentCarbon black1333-86-40.013440.190000.10536
PolymerEpoxy resin systemProprietary0.613498.670004.80759
subTotal7.07600100.0000055.45086
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000270.055500.00211
Tin solderTin (Sn)7440-31-50.4857199.940003.80624
subTotal0.48600100.000003.80852
WireImpurityNon hazardousProprietary0.000010.010000.00007
Pure metalCopper (Cu)7440-50-80.0878499.990000.68836
subTotal0.08785100.000000.68843
total12.76085100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.