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Chemical content PMN40ENE

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Type numberPackagePackage descriptionTotal product weight
PMN40ENESOT457SC-7412.53102 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069336115412601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0523677.000000.41784
PolymerResin systemProprietary0.0156423.000000.12481
subTotal0.06800100.000000.54265
DieDoped siliconSilicon (Si)7440-21-30.16000100.000001.27683
subTotal0.16000100.000001.27683
Lead FrameCopper alloyCopper (Cu)7440-50-84.5044095.1700035.94597
Iron (Fe)7439-89-60.107442.270000.85739
Phosphorus (P)7723-14-00.003310.070000.02644
Zinc (Zn)7440-66-60.005680.120000.04532
Pure metal layerSilver (Ag)7440-22-40.112172.370000.89516
subTotal4.73300100.0000037.77028
Mould CompoundAdditiveNon hazardousProprietary0.029010.410000.23152
FillerSilica -amorphous-7631-86-90.020520.290000.16376
Silica fused60676-86-06.0959786.1500048.64707
HardenerPhenolic resinProprietary0.303564.290002.42247
PigmentCarbon black1333-86-40.013440.190000.10729
PolymerEpoxy resin systemProprietary0.613498.670004.89576
subTotal7.07600100.0000056.46787
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000270.055500.00215
Tin solderTin (Sn)7440-31-50.4857199.940003.87605
subTotal0.48600100.000003.87837
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0080299.990000.06401
subTotal0.00802100.000000.06402
total12.53102100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.