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Chemical content PMN48XPA

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Type numberPackagePackage descriptionTotal product weight
PMN48XPAdummy POV SOT457SC-7411.21910 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068546115512601235Dongguan, China; Seremban, Malaysia; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0539077.000000.48043
PolymerResin systemProprietary0.0161023.000000.14351
subTotal0.07000100.000000.62394
DieDoped siliconSilicon (Si)7440-21-30.44000100.000003.92188
subTotal0.44000100.000003.92188
Lead FrameCopper alloyCopper (Cu)7440-50-84.1451897.0768036.94752
Iron (Fe)7439-89-60.091802.150000.81829
Phosphorus (P)7723-14-00.000650.015200.00579
Zinc (Zn)7440-66-60.002480.058000.02207
Pure metal layerSilver (Ag)7440-22-40.029890.700000.26642
subTotal4.27000100.0000038.06009
Mould CompoundFillerSilica fused60676-86-04.1677071.0000037.14826
PigmentCarbon black1333-86-40.017610.300000.15696
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.1563919.7000010.30733
Phenolic resinProprietary0.528309.000004.70893
subTotal5.87000100.0000052.32148
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00014
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00023
Tin solderTin (Sn)7440-31-50.5199599.990004.63449
subTotal0.52000100.000004.63496
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0491099.990000.43764
subTotal0.04910100.000000.43768
total11.21910100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.