Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMN55ENEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMN55ENEASOT457SC-7412.565075 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340696571157126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05236077.0000000.416711
PolymerResin systemProprietary0.01564023.0000000.124472
subTotal0.068000100.0000000.541183
DieDoped siliconSilicon (Si)7440-21-30.470000100.0000003.740527
subTotal0.470000100.0000003.740527
Lead FrameCopper alloyCopper (Cu)7440-50-84.50439695.17000035.848541
Iron (Fe)7439-89-60.1074392.2700000.855061
Phosphorus (P)7723-14-00.0033130.0700000.026368
Zinc (Zn)7440-66-60.0056800.1200000.045201
Pure metal layerSilver (Ag)7440-22-40.1121722.3700000.892729
subTotal4.733000100.00000037.667901
Mould CompoundFillerSilica -amorphous-7631-86-92.36617335.07000018.831347
Silica fused60676-86-02.95788543.84000023.540526
PigmentCarbon black1333-86-40.0168680.2500000.134241
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.67470010.0000005.369646
Phenol Formaldehyde resin (generic)9003-35-40.6706529.9400005.337428
Polyethylene (PE) -wax-9002-88-40.0607230.9000000.483268
subTotal6.747000100.00000053.696456
Post-PlatingImpurityLead (Pb)7439-92-10.0000220.0045000.000174
Non hazardousProprietary0.0002700.0555000.002147
Tin solderTin (Sn)7440-31-50.48570899.9400003.865543
subTotal0.486000100.0000003.867864
WireImpurityNon hazardousProprietary0.0000060.0100000.000049
Pure metalCopper (Cu)7440-50-80.06106999.9900000.486021
subTotal0.061075100.0000000.486070
total12.565075100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.