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Chemical content PMN70XP

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Type numberPackagePackage descriptionTotal product weight
PMN70XPSOT457SC-7412.49148 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069337115412601235Kuching Sarawak, Malaysia; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0523677.000000.41917
PolymerResin systemProprietary0.0156423.000000.12521
subTotal0.06800100.000000.54438
DieAluminium alloyAluminium (Al)7429-90-50.000340.280000.00269
Doped siliconSilicon (Si)7440-21-30.1196699.720000.95796
subTotal0.12000100.000000.96065
Lead FrameCopper alloyCopper (Cu)7440-50-84.5044095.1700036.05975
Iron (Fe)7439-89-60.107442.270000.86010
Phosphorus (P)7723-14-00.003310.070000.02652
Zinc (Zn)7440-66-60.005680.120000.04547
Pure metal layerSilver (Ag)7440-22-40.112172.370000.89799
subTotal4.73300100.0000037.88983
Mould CompoundAdditiveNon hazardousProprietary0.029010.410000.23225
FillerSilica -amorphous-7631-86-90.020520.290000.16428
Silica fused60676-86-06.0959786.1500048.80105
HardenerPhenolic resinProprietary0.303564.290002.43014
PigmentCarbon black1333-86-40.013440.190000.10763
PolymerEpoxy resin systemProprietary0.613498.670004.91126
subTotal7.07600100.0000056.64661
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00018
Non hazardousProprietary0.000270.055500.00216
Tin solderTin (Sn)7440-31-50.4857199.940003.88832
subTotal0.48600100.000003.89066
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalCopper (Cu)7440-50-80.0084899.990000.06788
subTotal0.00848100.000000.06789
total12.49148100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.