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Chemical content PMPB10XN

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Type numberPackagePackage descriptionTotal product weight
PMPB10XNSOT1220SOT12207.42070 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660518115312601235Dongguan, China; Kuching Sarawak, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00943
FillerSilver (Ag)7440-22-40.0588084.000000.79238
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09433
Isobornyl Methacrylate7534-94-30.003505.000000.04717
subTotal0.07000100.000000.94331
DieDoped siliconSilicon (Si)7440-21-30.51000100.000006.87267
subTotal0.51000100.000006.87267
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.45091
Magnesium (Mg)7439-95-40.004220.145900.05682
Nickel (Ni)7440-02-00.084352.918801.13673
Silicon (Si)7440-21-30.018280.632400.24629
Pure metal layerGold (Au)7440-57-50.000960.033300.01297
Nickel (Ni)7440-02-00.074012.561000.99738
Palladium (Pd)7440-05-30.003270.113000.04401
subTotal2.89000100.0000038.94511
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.56090
Silica fused60676-86-02.2380060.0000030.15888
Flame retardantMetal hydroxideProprietary0.111903.000001.50794
ImpurityBismuth (Bi)7440-69-90.018650.500000.25132
PigmentCarbon black1333-86-40.018650.500000.25132
PolymerEpoxy resin systemProprietary0.261107.000003.51854
Phenolic resinProprietary0.223806.000003.01589
subTotal3.73000100.0000050.26479
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1699099.940002.28951
subTotal0.17000100.000002.29088
WireImpurityNon hazardousProprietary0.000010.010000.00007
Pure metalCopper (Cu)7440-50-80.0506999.990000.68313
subTotal0.05070100.000000.68320
total7.42070100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.