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Chemical content PMPB11EN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB11ENSOT1220SOT12207.47386 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066621184112601235Hsin-chu, Taiwan; Kwai Chung, Hong Kong; Dongguan, China 
934066621115912601235Kwai Chung, Hong Kong; Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00937
FillerSilver (Ag)7440-22-40.0588084.000000.78674
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09366
Isobornyl Methacrylate7534-94-30.003505.000000.04683
subTotal0.07000100.000000.93660
DieDoped siliconSilicon (Si)7440-21-30.57000100.000007.62658
subTotal0.57000100.000007.62658
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.19164
Magnesium (Mg)7439-95-40.004220.145900.05642
Nickel (Ni)7440-02-00.084352.918801.12864
Silicon (Si)7440-21-30.018280.632400.24454
Pure metal layerGold (Au)7440-57-50.000960.033300.01288
Nickel (Ni)7440-02-00.074012.561000.99029
Palladium (Pd)7440-05-30.003270.113000.04369
subTotal2.89000100.0000038.66810
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.47867
Silica fused60676-86-02.2380060.0000029.94437
Flame retardantMetal hydroxideProprietary0.111903.000001.49722
ImpurityBismuth (Bi)7440-69-90.018650.500000.24954
PigmentCarbon black1333-86-40.018650.500000.24954
PolymerEpoxy resin systemProprietary0.261107.000003.49351
Phenolic resinProprietary0.223806.000002.99444
subTotal3.73000100.0000049.90729
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00126
Tin solderTin (Sn)7440-31-50.1699099.940002.27323
subTotal0.17000100.000002.27459
WireImpurityNon hazardousProprietary0.000000.010000.00006
Pure metalCopper (Cu)7440-50-80.0438599.990000.58674
subTotal0.04386100.000000.58680
total7.47386100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.