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Chemical content PMPB20EN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB20ENSOT1220SOT12207.24052 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066626184412601235Kwai Chung, Hong Kong; Hsin-chu, Taiwan; Dongguan, China 
934066626115912601235Hsin-chu, Taiwan; Kwai Chung, Hong Kong; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00967
FillerSilver (Ag)7440-22-40.0588084.000000.81210
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09668
Isobornyl Methacrylate7534-94-30.003505.000000.04834
subTotal0.07000100.000000.96679
DieDoped siliconSilicon (Si)7440-21-30.33000100.000004.55768
subTotal0.33000100.000004.55768
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956037.35799
Magnesium (Mg)7439-95-40.004220.145900.05823
Nickel (Ni)7440-02-00.084352.918801.16502
Silicon (Si)7440-21-30.018280.632400.25242
Pure metal layerGold (Au)7440-57-50.000960.033300.01329
Nickel (Ni)7440-02-00.074012.561001.02220
Palladium (Pd)7440-05-30.003270.113000.04510
subTotal2.89000100.0000039.91425
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.84860
Silica fused60676-86-02.2380060.0000030.90938
Flame retardantMetal hydroxideProprietary0.111903.000001.54547
ImpurityBismuth (Bi)7440-69-90.018650.500000.25758
PigmentCarbon black1333-86-40.018650.500000.25758
PolymerEpoxy resin systemProprietary0.261107.000003.60609
Phenolic resinProprietary0.223806.000003.09094
subTotal3.73000100.0000051.51564
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00130
Tin solderTin (Sn)7440-31-50.1699099.940002.34649
subTotal0.17000100.000002.34790
WireImpurityNon hazardousProprietary0.000010.010000.00007
Pure metalCopper (Cu)7440-50-80.0505299.990000.69770
subTotal0.05052100.000000.69777
total7.24052100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.