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Chemical content PMPB29XPE

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Type numberPackagePackage descriptionTotal product weight
PMPB29XPESOT1220SOT12207.41508 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066873115712601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00944
FillerSilver (Ag)7440-22-40.0588084.000000.79298
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09440
Isobornyl Methacrylate7534-94-30.003505.000000.04720
subTotal0.07000100.000000.94402
DieDoped siliconSilicon (Si)7440-21-30.52000100.000007.01274
subTotal0.52000100.000007.01274
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.47854
Magnesium (Mg)7439-95-40.004220.145900.05686
Nickel (Ni)7440-02-00.084352.918801.13759
Silicon (Si)7440-21-30.018280.632400.24648
Pure metal layerGold (Au)7440-57-50.000960.033300.01298
Nickel (Ni)7440-02-00.074012.561000.99814
Palladium (Pd)7440-05-30.003270.113000.04404
subTotal2.89000100.0000038.97463
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.56967
Silica fused60676-86-02.2380060.0000030.18174
Flame retardantMetal hydroxideProprietary0.111903.000001.50909
ImpurityBismuth (Bi)7440-69-90.018650.500000.25151
PigmentCarbon black1333-86-40.018650.500000.25151
PolymerEpoxy resin systemProprietary0.261107.000003.52120
Phenolic resinProprietary0.223806.000003.01817
subTotal3.73000100.0000050.30289
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00127
Tin solderTin (Sn)7440-31-50.1699099.940002.29125
subTotal0.17000100.000002.29262
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0350899.990000.47311
subTotal0.03508100.000000.47316
total7.41508100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.